Xperi Holding Corporation’s recently launched brand, Adeia, has entered a hybrid bonding license agreement with LAPIS Technology Co., Ltd., based in Japan, according to a press release.
“Our customers are at the forefront of advanced technology applications and continue to drive innovation in their fields. We are pleased to have the access to Adeia’s groundbreaking hybrid bonding technology that will propel our capabilities,” vice president, LSI & member, Board of Directors of LAPIS, Hiroyuki Fukuyama, said in a press release. “It enables us to support our customers’ future requirements to develop the next-generation of products.”
The ROHM Group company includes “a technology transfer of Adeia’s DBI® Ultra die-to-wafer hybrid bonding know-how to support the development and deployment of the technology into LAPIS’s product portfolio,” and a hybrid bonding patent catalog, according to the release.
With a long-established slate of intellectual property specializing in semiconductor packaging and semiconductor processing technology development projects executed with world partners, Adeia has led significant contributions to the semiconductor industry over the last three decades, a recent press release reveals.
“Combining LAPIS’s product development and manufacturing expertise with our foundational hybrid bonding technology and know-how will enable LAPIS to deliver a new generation of ASSPs and custom LSI ASICs,” said Dana Escobar, general manager of Adeia’s semiconductor business. “We look forward to continuing to work together and building upon our mutually beneficial technology partnership.”