Siemens has introduced the Innovator3D IC solution suite, designed to streamline the design and analysis of complex, heterogeneously integrated 3D integrated circuits (ICs). This new suite offers a comprehensive path for planning, integration, substrate/interposer implementation, interface protocol compliance analysis, and data management of designs and design data IP. It is built on an AI-infused user experience with multithreading and multicore capabilities aimed at optimizing capacity and performance for designs exceeding five million pins.
The Innovator3D IC solution suite includes several components: the Innovator3D IC Integrator for constructing digital twins using a unified data model; the Innovator3D IC Layout solution for package interposer and substrate implementation; the Innovator3D IC Protocol Analyzer for chiplet-to-chiplet and die-to-die interface compliance analysis; and the Innovator3D IC Data Management solution for managing work-in-progress designs.
In addition to this suite, Siemens has developed Calibre 3DStress to address challenges associated with thinner dies and higher processing temperatures in 2.5D/3D IC architectures. Calibre 3DStress supports accurate transistor-level analysis of thermo-mechanical stresses in 3D IC packaging. It allows designers to evaluate how chip-package interactions will affect functionality early in development, preventing future failures while optimizing performance and durability.
Building on its previous release of Calibre 3DThermal in 2024, Calibre 3DStress enhances Siemens' Multiphysics solutions by reducing thermo-mechanical impacts. Unlike other tools that focus on package-level stress analysis, Calibre 3DStress uniquely detects transistor-level stress to ensure circuit-level performance is not compromised by packaging processes or product functionalities.
Customer feedback highlights positive experiences with Siemens’ technologies. Bryan Black, CEO of Chipletz, stated that their adoption of Siemens’ technology since 2023 has been crucial in addressing complex design challenges in advanced platform solutions for AI and HPC datacenters. Sandro Dalle Feste from STMicroelectronics noted that Siemens EDA’s Calibre 3DStress tool aids in synthesizing complexities related to 3D IC architectures while providing accurate IP-level stress analysis. This capability enables improved reliability, quality, reduced time to market, benefiting both STMicroelectronics and their customers.
For more information about Siemens’ solutions for 2.5D/3DIC architectures, visit their website.
Siemens Digital Industries Software aims to help organizations digitally transform through software, hardware, and services offered via the Siemens Xcelerator business platform. Their comprehensive digital twin technology facilitates optimization across design, engineering, manufacturing processes from chips to entire systems across various industries.