Siemens enhances semiconductor design with new AI technologies

Siemens enhances semiconductor design with new AI technologies
Banking & Financial Services
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Anthony Casciano President and CEO | Siemens Financial Services

Siemens has announced enhancements to its semiconductor and PCB design portfolio through the introduction of generative and agentic AI technologies. The new EDA AI system offers customizable workflows, allowing users to integrate their own data. This system aims to improve productivity without disrupting existing processes, with enterprise-grade security and flexible deployment options.

Siemens is incorporating NVIDIA's AI technologies into its EDA workflows. Tim Costa, senior director of CAE and CUDA-X at NVIDIA, stated that "AI agents can dramatically boost productivity for complex electronic design automation." Siemens' system now supports NVIDIA NIM microservices and Llama Nemotron models, facilitating scalable deployment across environments.

The company has also unveiled Aprisa AI software as part of its portfolio expansion. Aprisa AI integrates next-generation features for digital implementation solutions, claiming enhanced productivity and faster time-to-market for silicon designs. Similarly, Calibre Vision AI aims to expedite chip integration signoff by clustering design violations for efficient prioritization.

Solido's platform now includes advanced generative and agentic AI capabilities tailored to various phases of custom IC development. These advancements are designed to deliver significant productivity gains in design and verification processes.

Siemens' EDA AI system is available for early access within the company's portfolio. More information on these solutions can be found on Siemens' official website.